Paper

analysis applied approach ASME assembly assumed axial beam behavior bonding boundary bump calculated chip circuit coefficient complex component conduction considered constant convection cooling crack creep cycle damage deformation determined developed direction discussed displacement distribution drive edge effects elastic Electronic element Engineering equation experimental failure fatigue finite element flow force function geometry given heat increase interface laser layer lead load material maximum measured mechanical Meeting method modules mounted normal obtained occur package parameters performance plane plastic plate present pressure printed problem properties range region resistance response shear shown in Figure shows signal Society solder joint solution step strain stress structure substrate surface Table temperature thermal thickness transfer typical values welding