Microelectronic Interconnections and Assembly
This text covers the proceedings of the NATO Advanced Research Workshop which is devoted to the technical aspects of advanced interconnections and microassembly and also includes papers on the education issues needed to prepare students for work in these areas. The future direction that such technologies may take is also dealt with.
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1998 Kluwer Academic adhesion alloys anodisation applications ball bonds ceramic chemical Chip Scale Package ChVS layers coating components copper cost density deposited devices dielectric permeability elastic modulus electrical electronic electroplating encapsulation etching evaluation failure Figure flip chip frequency function Harmon hermetic hybrid circuits Hybrid Microelectronics IEEE increase inorganic resists integrated circuits Interconnections and Assembly Kluwer Academic Publishers laminate laser lightsensitivity manufacturing materials MCM-D measurement mechanical metal microcells Microelectronic Interconnections microelectronics miniaturisation mismatch multichip modules multilayer nonlinearity optical interconnects Optoelectronic oxides parameters performance photodoping photoresist pitch plastic packaged plating polymer PQFP Printed printed circuit boards Proc production properties pull strength reflow resistors samples semiconductor sensors shearing shearing stress silicon simulation solder joints solution stress structure substrate surface mount switch temperature thermal thick film thin film voltage wafer waveguide wire bonding