Microelectronic Interconnections and AssemblyGeorge G. Harman, Pavel Mach Kluwer, 1998 - 299 Seiten Contains 28 presentations and three abstracts from the May 1996 workshop, which was devoted to the technical aspects of advanced interconnections and micro-assembly, but also included papers on the education issues required to prepare students to work in these areas. Several papers predict the future directions of packaging and interconnection. Other papers discuss wire bonding and Tape Automated Bonding (TAB). In addition, the solder metallurgy as well as the production technology of flip chip interconnections are described. Multichip Module and thick-film hybrid substrate interconnections are also covered. Annotation copyrighted by Book News, Inc., Portland, OR |
Andere Ausgaben - Alle anzeigen
Microelectronic Interconnections and Assembly G. G. Harman,Pavel Mach Keine Leseprobe verfügbar - 2014 |
Häufige Begriffe und Wortgruppen
achieved activities ageing alloys analysis applications assembly bonding bump ceramic circuits coatings compared components conductive connections copper cost density dependence deposited devices dielectric effect electrical electronic encapsulation equipment etching evaluation example failure Figure flip chip frequency function given heat hybrid increase industry integrated interconnection laser layer lead limited manufacturing materials measured mechanical metal method microelectronics modules mounted multilayer needs obtained operation optical package parameters performance pitch plastic plating polymers possible presented Printed production properties range reliability resistance sample shown shows silicon simulation solder solder joints solution strain strength stress structure substrate surface switch Table techniques temperature thermal thick film thin film University values wafer wire wire bonding