Microelectronic Interconnections and AssemblyGeorge G. Harman, Pavel Mach Kluwer, 1998 - 299 Seiten Contains 28 presentations and three abstracts from the May 1996 workshop, which was devoted to the technical aspects of advanced interconnections and micro-assembly, but also included papers on the education issues required to prepare students to work in these areas. Several papers predict the future directions of packaging and interconnection. Other papers discuss wire bonding and Tape Automated Bonding (TAB). In addition, the solder metallurgy as well as the production technology of flip chip interconnections are described. Multichip Module and thick-film hybrid substrate interconnections are also covered. Annotation copyrighted by Book News, Inc., Portland, OR |
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Häufige Begriffe und Wortgruppen
1998 Kluwer Academic adhesion Aluminum anodisation applications ball bonds ceramic Chip Scale Package ChVS layers coatings components conductive copper cost cycling density devices dielectric dielectric permeability elastic modulus electrical electronic electroplating equipment etching eutectic evaluation failure Figure Film Deposited flip chip function Harman heat high reliability IEEE increase industry integrated circuits Interconnections and Assembly Kluwer Academic Publishers laminate laser lightsensitivity Mach eds manufacturing materials MCM-D measurement mechanical metal Microelectronic Interconnections microelectronics miniaturisation mismatch multichip modules nonlinearity optical Oxide parameters performance photoresist pitch plastic packaged plating polymer PQFP printed circuit board production reflow resistors samples semiconductor sensors shearing stress silicon simulation solder bumps solder joints solution strain substrate surface mount switch techniques temperature thermal thick film thin film wafer waveguides wire bonding