Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-3American Society of Mechanical Engineers., 2001 |
Inhalt
RELIABILITY | 1430 |
IPACK200115727 1315 | 1431 |
IPACK200115596 779 | 1433 |
Urheberrecht | |
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adhesive analysis antenna application array assembly bump cavitating cavity circuit components Conference and Exhibition connector convection cost defect density developed devices dielectric effect electrical electromigration Electronic Packaging Technical epoxy etching evaluation Exhibition July 8-13 fabricated fiber film flip chip fluorescence frequency Gunn diode heat sink IEEE impact increase integrated interconnection International Electronic Packaging IPACK'01 The Pacific Kauai laser layer manufacturing material measured metal method mode module optical optical fiber output Pacific Rim/ASME International Packaging Technical Conference pantograph parameters performance planar plate printed circuit board Proceedings of IPACK'01 reflow reliability Rim/ASME International Electronic Sample sensor shown in Figure shows signal silicon simulation solder ball solder joint solder mask strain stress structure substrate surface temperature cycling thermal thickness TQFP underfill VCSEL velocity wafer waveguide width