Microelectronic Interconnections and Assembly
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
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1998 Kluwer Academic adhesion alloys anodisation applications ball bonds ceramic Chip Scale Package Chip Size Packages ChVS layers coatings components conductive copper cost density deposited devices dielectric dielectric permeability elastic modulus electrical electronic equipment etching eutectic evaluation failure flip chip function Harman heat hermetic packages high reliability hybrid circuits Hybrid Microelectronics IEEE increase industry integrated circuits Interconnections and Assembly Kluwer Academic Publishers laminate laser lightsensitivity Mach eds manufacturing materials MCM-D measured mechanical metal Microelectronic Interconnections microelectronics miniaturisation multichip modules multilayer nonlinearity Nordic countries Oxide parameters performance photoresist pitch plastic encapsulation plastic packaged plating polymer PQFP printed circuit board production reflow resistors samples semiconductor sensors silicon simulation solder joints solution stress structure substrate surface mount switch Technical University techniques temperature thermal thick film thin film TQFP wafer waveguides wire bonding