Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-2American Society of Mechanical Engineers., 1999 |
Inhalt
VOLUME 2 | 1083 |
SOLDERS | 1094 |
MECHANICS OF INTERFACES AND MULTILAYER MATERIALS | 1129 |
Urheberrecht | |
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Häufige Begriffe und Wortgruppen
accelerated adhesive Advances in Electronic analysis applications assembly Ball Grid Array bond Chip Scale Packages circuit components connectors convection cooling cost crack delamination density developed devices die attach distribution EEP-Vol effect elastic electrical Electronic Packaging encapsulant energy epoxy equation evaluation experimental factor fatigue fiber film finite element flip chip flow Fluorinert fracture function heat flux heat transfer coefficient increase interconnect interface JEDEC layer liquid load manufacturing material measured metal method module optical optical fibers parameters particles performance phase change plastic plate polyimide predicted pressure reflow resistance samples sensor shear shown in Figure silicon simulation solder balls solder bumps solder paste specimen strain stress substrate Suhir surface techniques temperature thermal conductivity thermal cycling thickness underfill values Volume 2 ASME wafer warpage