Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-2American Society of Mechanical Engineers., 2005 |
Inhalt
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IPACK200573380 503 | 830 |
IPACK200573446 641 | 833 |
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acceleration adhesive alloy analysis applied array ASME assembly Ball Grid Array behavior bump capacitor coefficient components copper Copyright crack creep deformation delamination density devices dielectric DRIE etching drop test effect Electronic Packaging equation eutectic evaluated experimental failure modes fatigue fiber Figure finite element finite element analysis flip chip fracture frequency IEEE increase Intel Corporation interconnect interface JEDEC layer load material maximum measured mechanical metal method Microelectronics module moisture molding nanoparticles OMUF optical Optical Fiber parameters PBGA performance piezoresistive plastic strain plating predict reflow peak temperature reliability residual stress resistance sample sensor shear stress shown in Fig shows silicon silicon dioxide simulation slurry Sn-Pb eutectic SnAgCu SnPb socket solder ball specimen strain rate strength structure substrate Suhir surface Technology test chip thermal cycling thermal stress underfill vibration wafer warpage wire bonding