Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-2American Society of Mechanical Engineers., 1995 |
Inhalt
VOLUME 2 | 583 |
VOLUME 1 | 586 |
STRUCTURAL ANALYSIS OF PACKAGES STRESS ANALYSIS AND RELIABILITY | 593 |
Urheberrecht | |
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adhesion strength Advances in Electronic analysis application behavior calculated ceramic channel chip power cold plate component configuration contact angle convection cooling copper correlation crack critical heat flux CTE mismatch curve deformation density determined developed displacement fields dissipation EEP-Vol effect Electronic Packaging ASME encapsulant Engineering epoxy equation evaluation evaporator experimental fatigue Figure finite element flip chip flow rate fluid fracture frequency fringe function geometry heat flux heat sink heat transfer coefficient increase interface interferometry layer lead liquid load material matrix measured method microelectronic module nozzle Nusselt Nusselt number obtained Packaging ASME 1995 parameters PowerPC PowerPC 603 PQFP prediction printed circuit board reliability Reynolds number sample shear shown in Fig silicon simulation solder joint specimen spray stress subcooling substrate Surface Mount Technology temperature rise thermal conductivity thermal cycling thermal grease thermal resistance thermosiphon thickness values velocity