Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Band 1American Society of Mechanical Engineers., 1999 |
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Inhalt
VOLUME | 1 |
5 | 23 |
Decomposition Techniques for the Efficient Analysis of AreaArray Packages | 33 |
Urheberrecht | |
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adhesion Advances in Electronic analysis applied array assembly Ball Grid Array base bonding boundary conditions calculated components convection copper crack deformation delamination density device die attach displacement EEP-Vol effect Electronic Packaging epoxy equation evaluation experimental failure fatigue test Figure finite element finite element analysis flip chip flow geometry heat sink IEEE increase interconnection interface laser layer loading maximum measured mechanical metal method module Nusselt Nusselt number optical optimization parameters Parylene PBGA phase piezoresistive plastic plate prediction printed circuit board ratio reflow reliability resistor sample sensor shear stress shown in Fig shows silicon simulation solder ball solder bump solder joint solder paste specimen strain rate structure substrate Table Technology temperature tensile thermal conductivity thermal cycling thermal fatigue thermal resistance thickness thin film underfill values velocity Volume 1 ASME wafer Young's modulus