Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-3American Society of Mechanical Engineers., 2001 |
Inhalt
MEMS | 588 |
IPACK200115818 577 | 595 |
IPACK200115513 | 617 |
Urheberrecht | |
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Häufige Begriffe und Wortgruppen
algorithm ASME average Bar-Cohen boiling boundary conditions calculated cell channel chip package circuit cold plate components compressor condenser configuration coolant cooling plate correlation critical heat flux cycle data center density developed device diameter effect equations Exhibition July 8-13 Figure fin heat sink fin height flow rate fluid function geometry grid heat conduction heat exchanger heat pipe heat source heat spreader heat transfer coefficient heater IGBT increase inlet interface International Electronic Packaging junction temperature Kauai layer liquid mass flow rate maximum measured method module natural convection node Nusselt Nusselt number optimization Pacific Rim/ASME International parameters pin fin power dissipation predicted pressure drop rack refrigerant Reynolds number shown in Fig shroud simulation solder joint subcooling substrate superheat surface temperature Technology temperature distribution thermal analysis thermal conductivity thermal management thermal performance thermal resistance thermocouples thickness transient values vapor velocity