Advances in Electronic Packaging: Proceedings of the ... Joint ASME/JSME Conference on Electronic Packaging, Bände 1-3American Society of Mechanical Engineers., 2001 |
Inhalt
VOLUME | 4 |
IPACK200115510 | 13 |
IPACK200115512 | 21 |
Urheberrecht | |
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Häufige Begriffe und Wortgruppen
adhesive alloy analysis applications array assembly Ball Grid Array behavior bond pads calculated circuit coefficient components conductivity crack deformation delamination die attach displacement DMDTM effect elastic electrical electroless Electronic Packaging Technical epoxy equation eutectic Exhibition July 8-13 experimental failure fatigue filler film finite element finite element analysis flip chip flow frequency heat sink heat transfer height IEEE increases interconnect interface International Electronic Packaging JEDEC Kauai Kirkendall voids layer lead-free maximum measured mechanical metal method migration modulus mold compound optical optimization Pacific Rim/ASME International Packaging Technical Conference parameters performance plastic plate polypyrrole prediction probe reflow reliability resistor Rim/ASME International Electronic sample sensors shear shown in Figure silicon silver simulation solder ball solder bump solder joints specimen strain structure substrate surface TEBGA Technology temperature thermal cycling thermal resistance thickness underfill wafer warpage wire wire bonding yield